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UW team uses extreme ultraviolet photolithography to create next-generation integrated circuits

Semiconductor devices are a critical component of the many electronics that power our daily lives. The technological innovations that have driven their widespread success have relied on manufacturing smaller and smaller integrated circuits to build more powerful devices. The next generation of integrated circuit development will require features smaller than 10 nanometers, something that is not currently possible in today’s commercial manufacturing landscape.

Following support from a UW Molecular Engineering & Sciences Institute (MolES) pilot award, UW professors David Bergsman and Aniruddh Vashisth have received a National Science Foundation Future Manufacturing award for a project that aims to address the 10 nanometer challenge in the field of semiconductor manufacturing.