In August 2025, the University of Washington (UW) hosted the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future Summer Intensive. The UW, five other U.S. universities, and six Japanese universities are sponsored by the National Science Foundation, Micron, and Tokyo Electron (TEL) to lead UPWARDS with the mission of developing semiconductor talent and expanding cutting-edge research. The Summer Intensive at UW is an immersive educational experience designed to prepare the next generation of semiconductor leaders.
Author: Corin
UW team uses extreme ultraviolet photolithography to create next-generation integrated circuits
Semiconductor devices are a critical component of the many electronics that power our daily lives. The technological innovations that have driven their widespread success have relied on manufacturing smaller and smaller integrated circuits to build more powerful devices. The next generation of integrated circuit development will require features smaller than 10 nanometers, something that is not currently possible in today’s commercial manufacturing landscape.
Following support from a UW Molecular Engineering & Sciences Institute (MolES) pilot award, UW professors David Bergsman and Aniruddh Vashisth have received a National Science Foundation Future Manufacturing award for a project that aims to address the 10 nanometer challenge in the field of semiconductor manufacturing.