UW Opportunities
Call for Applications
AY26-27 UPWARDS-UW Graduate Fellowship in Memory Technology Research
Background: The University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future program is dedicated to addressing the global semiconductor workforce shortage through an international collaboration between six U.S. universities, five Japanese universities, Micron Technology, and Tokyo Electron (TEL). Supported jointly by NSF, Micron, and TEL, UPWARDS aims to create a US-Japan network to foster awareness and opportunities for the next generation of talents and workforce in the global semiconductor ecosystem, with a particular focus on increasing and including the participation of women.
Memory-centric Research: Memory technology is foundational to all computing architectures and lies at the heart of Micron’s expertise. Through UPWARDS, Micron and TEL are committed to providing students and researchers with unique opportunities to gain hands-on experience in research labs and facility, focusing on memory product development and production. Interested research areas include materials and chemical characterization for next-generation memory products, energy-efficient memory solutions, high-performance logic, tool design, and memory-centric computing models.
UPWARDS Graduate Fellowship:UPWARDS Graduate Fellowship: AY26-27 is the third year of the UPWARDS-UW graduate fellowship program, which will continue to support six graduate fellows in the College of Engineering and the College of Arts and Sciences. Each fellowship includes a graduate research assistantship stipend plus benefits and tuition for 9 months of AY26-27. Each fellowship is renewable for up to one additional year based on satisfactory performance and review by a committee. AY25-26 fellows are eligible to apply for renewal.
Selection Criteria:
- Research Relevance: Applicants must conduct research in areas relevant to memory technology as outlined above.
- Promotion of Workforce Expansion: Applicants strongly commit to improving the welcoming environment of the semiconductor workforce by initiating and engaging in recruitment programs.
- Collaboration with UPWARDS Network Schools: Proposed research activities should demonstrate potential for collaboration with other academic partners within the UPWARDS network.
- Travel Commitment: Fellows are expected to travel to Japan at least once to participate in or lead UPWARDS student exchange programs.
Application Requirements:
The following application materials are required to be submitted to upwards@uw.edu with “UPWARDS Graduate Fellowship Application” in the subject line:
- CV/Resume
- Research statement addressing the selection criteria. If renewal, statement of past year’s achievement (2-page limit, font size 11 or larger)
- One recommendation letter from the applicant’s research or academic advisor
Application Deadline: July 15th, 2026. Review will begin immediately, with fellowship awards announced in August for the 2025-2026 academic year.
The University of Washington UPWARDS Summer Intensive
Program is a week-long internship that provides students with hands-on experience in semiconductor research at the Washington Nanofabrication Facility, knowledge of the current landscape of semiconductor research and industry and an opportunity to explore the Pacific Northwest.
The semiconductor industry requires a highly skilled and diverse workforce that can strengthen technology leadership and innovation across ecosystems in the U.S. and Japan. To address this need, the National Science Foundation, Micron and Tokyo Electron (TEL) sponsor the University of Washington, five other U.S. universities and six Japanese universities to build a cross-Pacific network called UPWARDS for the Future. UPWARDS aims to develop semiconductor talent, foster cross-collaboration and expand cutting-edge research.
The summer intensive program allows participants to build real semiconductor devices in a state-of-the-art cleanroom, preparing them for high-demand jobs in computer engineering, biotechnology, aerospace, physics, and chemistry. Students will attend a full-day orientation focused on the internship and safety protocols at the WNF. Each morning, they will conduct research at the WNF, and in the afternoons, they will hear from guest speakers in the semiconductor field and explore Seattle and the beautiful Pacific Northwest. The University of Washington will provide housing on or near campus from Saturday to Saturday.
The program is open to students currently enrolled in undergraduate and graduate programs at UPWARDS member universities. Completion of safety training is required before the internship.
Program dates: August 15-23, 2025
Application and nomination deadline: April 30, 2025
Program fee: $2,500
Lodging: On UW Campus
US Domestic Opportunities
Graduate Student Workshop, April 14-17
Boise State and the UPWARDS Network are excited to welcome graduate students from each of the 11 UPWARDS universities. The students’ schedules will be full of networking, research, experiential learning and opportunities to showcase their work. The workshop schedule includes campus and industry tours, meals and demos.
More information about lodging and logistics and a map of the campus are available on the Boise State Upwards site.
Contact:
Dan Lamborn, Boise State University:
daniellamborn@boisestate.edu
+1 (503)913-9506
UPWARDS @RIT – Immersive Learning Program in Rochester, NY
The UPWARDS Program provides students and faculty with a wide array of experience and exposure centered centered around hands-on-training sessions, technical demons demonstrations, tours of the Rochester Institute of Technology’s cutting-edge facilities and labs, time in clean rooms, seminars, globally recognized company visits and more.
The Immersive Learning Program in Rochester, NY semiconductor development is currently one of the fastest growing industries. Gain firsthand experience and insight in this highly sought after field at the cutting-edge facilities and labs at the Rochester Institute of Technology located in Rochester, New York.
Program Details
Tentative Dates: August 6-16, 2025
Location: Rochester, New York
Program Fee Per Participant: $3,500 USD
Limit # of Student Participants: 20 in total
To Apply: Your home university will nominate exchange students to RIT by Feb. 28th to Alyssa (anbgbl@rit.edu). Each university can select up to 4 student participants, together with 5 additional waitlisted students to Alyssa. Questions could be directed to Alyssa as well.
Program fees include:
Tuition for the eleven-day Certificate Program
Stay Accommodations (Tentative: August 6-16)
Program Orientation
Group Meals and Personal TigerBucks Dining Cards
Professional Visits and Cultural Excursions
Transportation for Program Activities
Transportation to and from the ROC airport
Please note: Students should plan on additional costs for daily meals and personal, miscellaneous spending. Program does not include cost of airfare,health or travel insurance or visitor visa costs.
Contact information:
Kate Gleason
Jing Zhang, Ph.D. Associate Professor
College of Engineering
jzeme@rit.edu
Alyssa Brault,
Program Administrator International
Education and Global Programs
anbgbl@rit.edu
Japanese Opportunities
Hiroshima University UPWARDS Summer Intensive Program 2026 – “Peace and Semiconductor Innovation”
Dates: 12 days, from July 22–August 2, 2026
Location & Venue: Hiroshima University (Higashi-Hiroshima campus) Higashi-Hiroshima City, Japan
Maximum Enrollment from Partner Universities:
Up to 22 participants in total:
12 students from U.S. partner universities (2 students from each of 6 universities)
5 students from 4 Japanese partner universities
5 students from Hiroshima University
Program Fee:
$2,500 per student
Requirements
Students currently enrolled in undergraduate or graduate programs at a UPWARDS member university are eligible to apply.
Application
Deadline: April 8, 2026
2026 UPWARDS Summer Intensive Application
Curriculum Overview
The Hiroshima University UPWARDS Summer School 2026 – “Peace and Semiconductor Innovation” is a 12-day interdisciplinary program combining peace learning in Hiroshima with hands-on semiconductor training at the Research Institute for Semiconductor Engineering (RISE).
Participants will gain both scientific and cultural perspectives, exploring how technology and innovation contribute to a sustainable and peaceful society.
Program Overview
Week 1 – Orientation & Industry Engagement
• Welcome & Orientation at Hiroshima University
• Campus Tour and Networking with Tokyo Electron (TEL)
• Visit to Micron Memory Japan
• Free weekend for self-guided activities
Week 2 – Semiconductor Training & Regional Collaboration
• CMOS Practical Training at RISE (Layout Design, Process Lecture & Cleanroom Tour, Measurement)
• Peace Study at Hiroshima Peace Memorial Park
• Visit to Saijo City, Ehime Prefecture
• Shimanami Kaido Island-Hoping Tour
• Networking with CMOS participants and industry partners
Final Day
• Student Presentations
• Closing Ceremony & Farewell Part
Acquirable Competencies
☐ Competency 1 – Foundational Knowledge in Semiconductor Engineering
☒ Competency 2 – Foundational Knowledge in Semiconductor Industry and Business
☐ Competency 3 – Ability to Manage/Understand Diversity, Equity and Inclusion
☒ Competency 4 – Gain Global/Inter-Cultural Competencies including International Mindset, Inter- Cultural Competence, Collaboration and Teamwork, Communication Skills, and Leadership
☒ Competency 5 – Hands-on Experiences of Semiconductor Industry Operations
☐ Competency 6 – Research Application Skills
Study Hours:
Full 8 days of structured program (lectures, hands-on labs, and networking sessions), equivalent to approximately 80 total study hours, designed to achieve Competencies 2, 4, and 5.
Accommodation Information:
Hiroshima University will provide accommodation for all participants during the 12-day summer school.
Program Coordinator
Dr. Linh Cao
Contact Info:
Academic Contact: Dr. Linh Cao
Research Institute for Semiconductor Engineering (RISE), Hiroshima University
Email: linhthuyacao@hiroshima-u.ac.jp
Administrative Contacts:
Ms. Watanabe, Mr Miyagaki
Global Strategy Group, Hiroshima University
Email: kokusai-group@office.hiroshima-u.ac.jp
Kyushu University Summer Internship 2026
Dates: July 28–Aug. 5, 2026 *Dormitory check in: July 27 (Mon), check out: August 6 (Thu)
Location & Venue: Kyushu University Ito Campus, 744 Motooka, Nishi-ku, Fukuoka, JAPAN
Maximum Enrollment from Partner Universities:
Open to two students from each partner.
Program Fee:
2,800 USD
Requirements:
- Undergraduate student in department/course of electrical engineering, material science, applied physics, information science, or information technology who is interested in
Semiconductor technology or business. - Graduate student in STEM field who is interested in the theme related with Semiconductor.
- PhD student matching the proposed research topic related with Semiconductor
Application:
Deadline: April 8, 2026
2026 UPWARDS Summer Intensive Application
Curriculum Overview:
1.) Introduction of semiconductor
2.) Applied course of semiconductors – Business/Sustainable/Social implementation
3.) Short term study in laboratories — it is a main part of this program. The research topic will be announced at recruitment.
4.) Company tours in Kyushu area
Acquirable Competencies
☒ Competency 1 – Foundational Knowledge in Semiconductor Engineering
☒ Competency 2 – Foundational Knowledge in Semiconductor Industry and Business
☒Competency 4 – Gain Global/Inter-Cultural Competencies including International
Mindset, Inter- Cultural Competence, Collaboration and Teamwork, Communication
Skills, and Leadership
☒ Competency 5 – Hands-on Experiences of Semiconductor Industry Operations
☒ Competency 6 – Research Application Skills
Study Hours:
56 hours
Accommodation Information:
Students will be assigned to one of the dormitories on the Ito Campus, each offering single rooms. The most likely options are Harmony House or Dormitory 2.
https://www.isc.kyushu-u.ac.jp/intlweb/en/student/housing/dormitory
Program Coordinator:
Hiromi Yuasa
Contact Info:
upwards@mag.ed.kyushu-u.ac.jp
kotio@jimu.kyushu-u.ac.jp
hiromi.yuasa@ed.kyushu-u.ac.jp
UPWARDS Summer Intensive Program at Nagoya University (2026 Program)
Dates: July 27–August 7, 2026
Location: Nagoya University, Nagoya, Japan
Maximum Enrollment from Partner Universities:
1~3 students per university (up to 18 students in total)
Program Fee:
Approximately $3,200 USD per student
Requirements
Students currently enrolled in a graduate or undergraduate program at an UPWARDS member university do not need a visa to enter Japan.
Application Method
Deadline: April 8, 2026
2026 UPWARDS Summer Intensive Application
Curriculum Overview:
Nagoya University will offer a two-week summer intensive program in Nagoya, Japan,
focusing on cutting-edge semiconductor device and process technologies.
Highlights include:
Visits to semiconductor-related companies and laboratories in the UPWARDS and/or Chubu industrial cluster district. Participants will have the chance to:
-
- The opportunity is to conduct experiments in multiple laboratories and participate in
tours of CIRFE Transformative Electronics Facilities, the Center for Low-temperature Plasma Sciences, and several Clean Rooms. - Introductory lectures on semiconductors and presentations by faculty and students about their research.
- Visits to semiconductor-related companies and laboratories in the UPWARDS and/or Chubu industrial cluster district.
- The opportunity is to conduct experiments in multiple laboratories and participate in
Participants will have the chance to:
-
- Work with undergraduate and graduate students, including NU student tutors, on research related to semiconductor material/process/device technologies.
-
- Receive a thorough debrief on the experimental experience conducted in research labs.
-
- Join a campus and semiconductor industrial factory tour and immerse yourself in Japanese culture.
Acquirable Competencies
☒ Competency 1 – Foundational Knowledge in Semiconductor Engineering
☒ Competency 2 – Foundational Knowledge in Semiconductor Industry and Business
☒ Competency 3 – Ability to Manage/Understand Diversity, Equity, and Inclusion
☒ Competency 4 – Gain Global/Inter-Cultural Competencies including International Mindset, Inter- Cultural Competence, Collaboration and Teamwork, Communication Skills, and Leadership
☐ Competency 5 – Hands-on Experiences of Semiconductor Industry Operations
☒ Competency 6 – Research Application Skills
Study Hours
60 hours
Accommodation Information
Nagoya University will provide accommodation from the night of July 27 to the morning of August 7, 2026.
Program Coordinator
Osamu Nakatsuka, Dulamjav Norjin
Contact Information
Nagoya University UPWARDS members
E-mail: upwards@t.mail.nagoya-u.ac.jp
Program Information
Leading-edge Semiconductor Research Strategy Office website:
https://nusemicon.skr.jp/upwards/nu_summer_program_2026/
Science Tokyo UPWARDS Summer Program 2026
Dates: August 21–August 28, 2026
Location & Venue: Institute of Science Tokyo (Ookayama Campus), Tokyo, Japan
Maximum Enrollment from Partner Universities
12 students in total (2 students per U.S. partner university)
Program Fee:
1,500 USD per student (Accommodation fees, meal expenses, and public transportation
costs are not included.)
Requirements:
Students currently enrolled in undergraduate or graduate programs at an UPWARDS member university.
Students with experience in programming, logic design, computer systems, AI, etc., and a strong interest in semiconductor technology are encouraged to apply.
Application
Deadline: April 8, 2026
2026 UPWARDS Summer Intensive Application
Curriculum Overview
Microprocessor Experiential Learning Program (tentative）
August 21 (Fri) Orientation, Campus Tour, Lecture, Welcome Party
August 22 (Sat) Free
August 23 (Sun) Free
August 24 (Mon) Microprocessor Lab
August 25 (Tue) Microprocessor Lab
August 26 (Wed) Microprocessor Lab
August 27 (Thu) Microprocessor Lab
August 28 (Fri) Student Presentations, Closing Ceremony, Farewell Party
- AI application development using RISC-V microprocessors.
- Learn to use our Institute’s C2RTL hardware-software co-design environment and experience cutting-edge AI chip development methodologies.
- During the above period, participants will also experience Japanese culture.
Competencies to be Acquired
☐Competency 1 Foundational Knowledge in Semiconductor Engineering
☐ Competency 2 Foundational Knowledge in Semiconductor Industry and
Business
☐ Competency 3 Ability to Manage/Understand Diversity, Equity, and
Inclusion
☒ Competency 4 Gain Global/Inter-Cultural Competencies including
International Mindset, Inter-Cultural Competence,
Collaboration and Teamwork, Communication Skills, and
Leadership
☐ Competency 5 Hands-on Experiences of Semiconductor Industry Operations
☒ Competency 6 Research Application Skills
Study Hours
40 hours
Accommodation Information
Information on accommodation near the Institute will be provided. Participating students should arrange their own lodgings in accordance with the instructions of their home university regarding fees.
Program Coordinator:
Takahiro Sasaki
Contact Information:
upwards.summer@adm.isct.ac.jp
Global Education Division
Tohoku University Summer Program 2026
Dates: July 29–August 7, 2026
Location & Venue: Tohoku University, Sendai, Japan
Maximum Enrollment from Partner Universities:
20: 1~3 students per university, from both U.S. and Japan
Please note that if the total number of nominees exceeds 20, it may not be possible to accept all nominees. We appreciate your understanding.
Program Fee:
USD 3,500 per student
Requirements:
Students enrolled in undergraduate or graduate programs in semiconductor-related fields.
Application
Deadline: April 8, 2026
2026 UPWARDS Summer Intensive Application
Curriculum Overview
- Tue. July 28: Arrival day
- Wed. July 29: Orientation, Campus tour and Welcome ceremony
- Thu. July 30: Open campus
- Fri. July 31: Training session 1
- Sat. August 1: Field trip
- Sun. August 2: Free day
- Mon. August 3: Training session 2
- Tue. August 4: Industry tour
- Wed. August 5: Training session 3, Eve of Sendai Tanabata Festival (fireworks)
- Thu. August 6: Training session 4
- Fri. August 7: Wrap up and Closing ceremony
- Sat. August 8: Departure day
Competencies to be Acquired
☒ Competency 1 – Foundational Knowledge in Semiconductor Engineering
☒ Competency 2 – Foundational Knowledge in Semiconductor Industry and Business
☒ Competency 3 – Ability to Manage/Understand Diversity, Equity and Inclusion
☒ Competency 4 – Gain Global/Inter-Cultural Competencies including International Mindset, Inter-Cultural Competence, Collaboration and Teamwork, Communication Skills, and Leadership
☒ Competency 5 – Hands-on Experiences of Semiconductor Industry Operations
☒ Competency 6 – Research Application Skills
Study Hours
55.5 hours
Accommodation Information
Tohoku University will provide accommodation at a business hotel in Sendai City, covering the period from July 28 to August 8.
Program Coordinator:
Shunji Suzuki, Specially Appointed Professor (Management)
upwards-students@grp.tohoku.ac.jp
Contact Information
Tohoku University UPWARDS Students Exchange Office
e-mail: upwards-students@grp.tohoku.ac.jp
Program Information
Information will be available soon at https://www.s-hub.tohoku.ac.jp/
A distinctive feature of Tohoku University’s semiconductor research is the comprehensive coverage of technology value chain from device to package development, and even equipment and material development. In this program, participants will visit various research labs on campus, feeling Tohoku University’s 78-year history of semiconductor research, with the largest clean room area among Japanese academia (total of 8,500m2), while also learning about the latest research and witnessing a legend that continues to be updated.